Ceva Retains Top Spot in Wireless Connectivity IP in Latest IPnest Report
Ceva (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, has maintained its dominant position in Wireless Connectivity IP according to IPnest's 2025 Design IP Report. The company achieved a 68% market share in 2024, more than 10 times larger than its closest competitor.
The company's Ceva-Waves鈩� family offers comprehensive wireless connectivity solutions including Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT. Notable developments include the Ceva-Waves-Links platform for multi-standard configurations and the Dragonfly platform for LTE-M and NB-IoT connectivity. Ceva recently expanded its portfolio with Bluetooth 7 RF IP on TSMC 12nm, demonstrating its commitment to complete wireless solutions.
Ceva (NASDAQ: CEVA), leader nella concessione di licenze di propriet脿 intellettuale (IP) per silicio e software nel settore Smart Edge, ha mantenuto la sua posizione dominante nel campo della connettivit脿 wireless secondo il Rapporto IPnest 2025 sul Design IP. Nel 2024, l'azienda ha raggiunto una quota di mercato del 68%, pi霉 di 10 volte superiore rispetto al concorrente pi霉 vicino.
La famiglia Ceva-Waves鈩� dell'azienda offre soluzioni complete per la connettivit脿 wireless, includendo Bluetooth, Wi-Fi, UWB, 802.15.4 e IoT cellulare. Tra gli sviluppi pi霉 rilevanti vi sono la piattaforma Ceva-Waves-Links per configurazioni multi-standard e la piattaforma Dragonfly per la connettivit脿 LTE-M e NB-IoT. Recentemente, Ceva ha ampliato il proprio portafoglio con Bluetooth 7 RF IP su TSMC 12nm, dimostrando il suo impegno verso soluzioni wireless complete.
Ceva (NASDAQ: CEVA), el principal licenciante de propiedad intelectual (IP) de silicio y software para Smart Edge, ha mantenido su posici贸n dominante en IP de conectividad inal谩mbrica seg煤n el Informe de Dise帽o IP 2025 de IPnest. La compa帽铆a alcanz贸 una cuota de mercado del 68% en 2024, m谩s de 10 veces mayor que su competidor m谩s cercano.
La familia Ceva-Waves鈩� ofrece soluciones integrales de conectividad inal谩mbrica que incluyen Bluetooth, Wi-Fi, UWB, 802.15.4 e IoT celular. Entre los desarrollos destacados se encuentran la plataforma Ceva-Waves-Links para configuraciones multiest谩ndar y la plataforma Dragonfly para conectividad LTE-M y NB-IoT. Recientemente, Ceva ampli贸 su portafolio con Bluetooth 7 RF IP en TSMC 12nm, demostrando su compromiso con soluciones inal谩mbricas completas.
Ceva (NASDAQ: CEVA)電� 鞀る韸� 鞐ｌ毳� 鞙勴暅 鞁るΜ旖� 氚� 靻岉攧韸胳洦鞏� IP 霛检澊靹犾姢 攵勳暭鞚� 靹犽憪欤检瀽搿�, IPnest鞚� 2025雲� 霐旍瀽鞚� IP 氤搓碃靹滌棎 霐半ゴ氅� 氍挫劆 鞐瓣舶靹� IP 攵�氍胳棎靹� 歆�氚办爜鞚� 鞙勳箻毳� 鞙犾頃橁碃 鞛堨姷雼堧嫟. 須岇偓電� 2024雲勳棎 68%鞚� 鞁滌灔 鞝愳湢鞙�鞚� 雼劚頄堨溂氅�, 鞚措姅 臧�鞛� 臧�旯岇毚 瓴届焷鞛愲炒雼� 10氚� 鞚挫儊 韥� 靾橃箻鞛呺媹雼�.
Ceva鞚� Ceva-Waves鈩� 鞝滍拡甑办潃 敫旊（韴姢, Wi-Fi, UWB, 802.15.4, 靺�耄半煬 IoT 霌� 韽磩鞝侅澑 氍挫劆 鞐瓣舶 靻旊（靺橃潉 鞝滉车頃╇媹雼�. 欤茧頃� 毵岉暅 臧滊皽搿滊姅 雼れ 響滌 甑劚鞚� 鞙勴暅 Ceva-Waves-Links 頂岆灚韽缄臣 LTE-M 氚� NB-IoT 鞐瓣舶鞚� 鞙勴暅 Dragonfly 頂岆灚韽检澊 鞛堨姷雼堧嫟. Ceva電� 斓滉芳 TSMC 12nm 瓿奠爼 旮半皹鞚� Bluetooth 7 RF IP毳� 於旉皜頃橂┌ 鞕勲步頃� 氍挫劆 靻旊（靺橃棎 雽�頃� 鞚橃毳� 氤挫棳欤缄碃 鞛堨姷雼堧嫟.
Ceva (NASDAQ : CEVA), principal conc茅dant de licences de propri茅t茅 intellectuelle (IP) en silicium et logiciels pour le Smart Edge, a conserv茅 sa position dominante dans l'IP de connectivit茅 sans fil selon le rapport IPnest Design IP 2025. L'entreprise a atteint une part de march茅 de 68 % en 2024, plus de dix fois sup茅rieure 脿 celle de son concurrent le plus proche.
La famille Ceva-Waves鈩� propose des solutions compl猫tes de connectivit茅 sans fil, incluant Bluetooth, Wi-Fi, UWB, 802.15.4 et l'IoT cellulaire. Parmi les d茅veloppements notables figurent la plateforme Ceva-Waves-Links pour des configurations multi-normes et la plateforme Dragonfly pour la connectivit茅 LTE-M et NB-IoT. Ceva a r茅cemment 茅largi son portefeuille avec le Bluetooth 7 RF IP sur TSMC 12nm, d茅montrant son engagement envers des solutions sans fil compl猫tes.
Ceva (NASDAQ: CEVA), der f眉hrende Lizenzgeber von Silizium- und Software-IP f眉r Smart Edge, hat laut dem IPnest Design IP Bericht 2025 seine dominierende Position im Bereich Wireless Connectivity IP behauptet. Das Unternehmen erzielte 2024 einen Marktanteil von 68%, mehr als das Zehnfache des n盲chstgr枚脽eren Wettbewerbers.
Die Ceva-Waves鈩� Familie bietet umfassende L枚sungen f眉r kabellose Konnektivit盲t, darunter Bluetooth, Wi-Fi, UWB, 802.15.4 und zellulares IoT. Zu den bemerkenswerten Entwicklungen z盲hlen die Ceva-Waves-Links Plattform f眉r Multi-Standard-Konfigurationen sowie die Dragonfly Plattform f眉r LTE-M und NB-IoT Konnektivit盲t. Ceva hat k眉rzlich sein Portfolio um Bluetooth 7 RF IP auf TSMC 12nm erweitert und damit sein Engagement f眉r vollst盲ndige drahtlose L枚sungen unterstrichen.
- Dominant 68% market share in wireless connectivity IP, 10x larger than closest competitor
- Comprehensive portfolio covering multiple wireless standards (Bluetooth, Wi-Fi, UWB, 802.15.4, cellular IoT)
- Recent expansion into RF IP with Bluetooth 7 technology on TSMC 12nm
- Strong positioning in growing smart edge device market
- None.
Insights
Ceva's 68% wireless connectivity IP market share signals strong competitive positioning and revenue potential in the growing smart edge market.
Ceva's dominant
The company's strategic expansion into a unified IP portfolio that combines wireless connectivity with AI and sensing capabilities is particularly noteworthy. This integration addresses crucial market demands for reduced latency, improved privacy, and enhanced energy efficiency in edge devices. By offering complete solutions from baseband to RF (including their recent Bluetooth 7 RF IP on TSMC 12nm), Ceva is positioning itself as a one-stop shop for semiconductor companies developing next-generation SoCs and MCUs.
The IPnest report validation strengthens Ceva's market credibility and likely enhances its licensing negotiating position. As AIoT applications proliferate across consumer and industrial sectors, Ceva's comprehensive IP portfolio should drive increased licensing opportunities and potentially higher royalty streams. Their market dominance suggests strong execution in both technology development and customer acquisition, providing a solid foundation for continued growth as wireless connectivity becomes increasingly essential in smart edge devices.
The growing convergence of , on-device AI, and is driving a new wave of smart edge devices, particularly in consumer and industrial SoCs and MCUs. As these devices increasingly require real-time decision-making, local data processing has become essential for reducing latency, preserving privacy, and improving energy efficiency. Ceva's integrated IP portfolio supports this shift by allowing seamless implementation of connectivity, , and sensor technologies - helping customers deliver smarter, more responsive, and secure products.
"Wireless connectivity is foundational to the smart edge, and our continued leadership in this space reflects the trust our customers place in Ceva to deliver high-performance, low-power IP solutions," said Michael Boukaya, Chief Operating Officer at Ceva. "The latest IPnest report reinforces our strategy to build on this leadership by offering a unified IP portfolio that integrates wireless, sensing, and AI capabilities鈥攅nabling our customers to accelerate innovation across the evolving AIoT landscape."
"Ceva remains the benchmark in Wireless Interface IP," said Dr. Eric Esteve, Principal Analyst at IPnest. "Their broad portfolio and consistent innovation make them the go-to partner for integrating multi-standard wireless into SoCs."
The Ceva-Waves鈩� family offers the industry's most comprehensive wireless connectivity IP portfolio, spanning Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT. Optimized for seamless SoC and MCU integration, these IPs support both single and multi-standard configurations through the Ceva-Waves-Links platform. The portfolio also includes the Ceva-Waves Dragonfly platform, a fully integrated solution for LTE-M and NB-IoT connectivity with optional GNSS and eSIM support鈥攊deal for low-power, wide-area applications such as asset tracking, smart metering, and industrial monitoring. Ceva recently expanded its Ceva-Waves platform to include RF IP, introducing its first Bluetooth 7 RF IP on TSMC 12nm, alongside support for IEEE 802.15.4鈥攆urthering its commitment to delivering complete, silicon-proven wireless solutions from baseband to RF. For more information, visit .
About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the . Our , sensing and technologies are at the heart of some of today's most advanced smart edge products. From , , and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI s, processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple 鈥� to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 19 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.
Our headquarters are in
Ceva: Powering the Smart Edge鈩�
Visit us at and follow us on , , , and .
Logo:
View original content:
SOURCE Ceva, Inc.
FAQ
What is Ceva's current market share in Wireless Connectivity IP for 2024?
What wireless technologies are included in Ceva's IP portfolio?
What is Ceva's latest RF IP development on TSMC process?
What is the Ceva-Waves Dragonfly platform used for?
