New CPC Solution Tackles Growing Liquid Cooling Needs for AI
Dover's (NYSE:DOV) subsidiary CPC has unveiled the Everis庐 UQD06 Series connectors, a new liquid cooling solution specifically designed for AI computing applications. The product features a larger 3/8-inch flow path and joins CPC's universal quick disconnect (UQD) line targeting hyperscale AI, data centers, and high-performance computing.
According to Hyperion Research, liquid cooling adoption in HPC/AI sites is expected to increase from current two-thirds to nearly 80% within the next 12-18 months. The new solution addresses the growing demand for optimized cooling systems capable of handling the substantial heat generated by AI workloads.
La controllata di Dover (NYSE:DOV), CPC, ha presentato i connettori Everis庐 UQD06 Series, una nuova soluzione di raffreddamento a liquido specificamente progettata per applicazioni di calcolo AI. Il prodotto dispone di un percorso di flusso pi霉 ampio da 3/8 di pollice e fa parte della linea di disconnessione rapida universale (UQD) di CPC, rivolta a hyperscale AI, data center e calcolo ad alte prestazioni.
Secondo Hyperion Research, l'adozione del raffreddamento a liquido nei siti HPC/AI dovrebbe aumentare dall'attuale due terzi a quasi l'80% entro i prossimi 12-18 mesi. La nuova soluzione risponde alla crescente domanda di sistemi di raffreddamento ottimizzati, in grado di gestire il notevole calore generato dai carichi di lavoro AI.
La filial de Dover (NYSE:DOV), CPC, ha presentado los conectores Everis庐 UQD06 Series, una nueva soluci贸n de enfriamiento l铆quido dise帽ada espec铆ficamente para aplicaciones de computaci贸n AI. El producto cuenta con un flujo m谩s grande de 3/8 de pulgada y forma parte de la l铆nea universal de desconexi贸n r谩pida (UQD) de CPC, dirigida a AI a gran escala, centros de datos y computaci贸n de alto rendimiento.
厂别驳煤苍 Hyperion Research, se espera que la adopci贸n del enfriamiento l铆quido en sitios HPC/AI aumente desde los actuales dos tercios hasta casi el 80% en los pr贸ximos 12-18 meses. La nueva soluci贸n responde a la creciente demanda de sistemas de enfriamiento optimizados capaces de manejar el calor considerable generado por las cargas de trabajo de AI.
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La filiale de Dover (NYSE:DOV), CPC, a d茅voil茅 les connecteurs Everis庐 UQD06 Series, une nouvelle solution de refroidissement liquide sp茅cialement con莽ue pour les applications de calcul IA. Le produit dispose d'un chemin d'茅coulement plus large de 3/8 de pouce et rejoint la gamme de d茅connexion rapide universelle (UQD) de CPC, ciblant l'IA 脿 grande 茅chelle, les centres de donn茅es et le calcul haute performance.
Selon Hyperion Research, l'adoption du refroidissement liquide dans les sites HPC/IA devrait passer des actuels deux tiers 脿 pr猫s de 80% dans les 12 脿 18 prochains mois. Cette nouvelle solution r茅pond 脿 la demande croissante de syst猫mes de refroidissement optimis茅s capables de g茅rer la chaleur importante g茅n茅r茅e par les charges de travail IA.
Dovers (NYSE:DOV) Tochtergesellschaft CPC hat die Everis庐 UQD06 Series Steckverbinder vorgestellt, eine neue Fl眉ssigkeitsk眉hlungsl枚sung, die speziell f眉r KI-Computing-Anwendungen entwickelt wurde. Das Produkt verf眉gt 眉ber einen gr枚脽eren 3/8-Zoll-Durchflussweg und geh枚rt zur universellen Schnelltrennlinie (UQD) von CPC, die auf Hyperscale-KI, Rechenzentren und Hochleistungsrechnen abzielt.
Laut Hyperion Research wird erwartet, dass die Einf眉hrung von Fl眉ssigkeitsk眉hlung an HPC/AI-Standorten innerhalb der n盲chsten 12-18 Monate von derzeit
- Introduction of innovative UQD06 Series connectors with larger 3/8-inch flow path for enhanced cooling capacity
- Strong market opportunity with liquid cooling adoption in HPC/AI expected to reach 80% in 12-18 months
- Strategic positioning as technology partner to leading chip manufacturers and cooling integrators
- Higher flow rates may require increased pumping capabilities, potentially affecting system design and energy efficiency
Insights
Dover's CPC unit introduces high-flow liquid cooling connectors targeting the rapidly growing AI infrastructure market, positioning strategically in critical cooling technologies.
Dover's CPC business unit has unveiled its Everis UQD06 Series connectors, specifically engineered to address the intensifying cooling challenges in AI computing environments. This product expansion represents a strategic move in the rapidly growing AI infrastructure market.
The technical specifications are particularly noteworthy - these connectors feature a 3/8-inch flow path, complementing CPC's existing 1/8-inch and 1/4-inch options in their UQD family. This increased diameter is critical as it directly addresses the higher flow rates needed for efficient AI cooling without requiring proportionally higher pumping capabilities, which could otherwise compromise energy efficiency.
The timing of this release aligns perfectly with market trends. According to Hyperion Research data cited in the release, approximately two-thirds of HPC/AI sites have already implemented some form of liquid cooling, with adoption projected to reach nearly 80% within 12-18 months. This suggests Dover is positioning CPC to capture significant market share in a rapidly expanding segment.
What's particularly valuable is CPC's established relationships with leading chip manufacturers and cooling integrators. These partnerships provide Dover with both market intelligence and distribution channels that are difficult for competitors to replicate. The mention of extensive testing and patented technology indicates meaningful barriers to entry that could protect margins even as this market segment grows.
This product launch represents Dover's strategic recognition of AI's exponential growth trajectory and the corresponding infrastructure requirements - specifically addressing the often-overlooked but critical cooling components that enable computational performance at scale.
Everis庐 UQD06 Series connectors are designed specifically to handle AI's higher-flow liquid cooling requirements. The product is the latest in CPC's universal quick disconnect (UQD) line, which is purpose-built for hyperscale AI, data center and high-performance computing (HPC) applications.
"The substantial heat generated by AI workloads requires new ways to optimize flow in liquid cooling systems," said Patrick Gerst, General Manager of CPC's thermal business unit. "With the UQD06 Series, CPC is building on our long track record of delivering much-needed solutions for efficient cooling. We remain focused on supporting AI's expansion and unique liquid cooling specifications through innovation at scale."
While higher flow rates alone can improve cooling, the industry is seeking optimized cooling. "Increased flow often requires higher pumping capabilities, which can affect overall system design and energy efficiency," said Gerst. "Increasing the connector's flow path size is one way to add flow capacity."
According to Hyperion Research, about two-thirds of HPC/AI sites have implemented some form of liquid cooling, with adoption expected to reach nearly
"As a trusted technology partner to leading chip manufacturers and cooling integrators, we provide solutions that help protect mission-critical applications, particularly as AI continues to scale rapidly," says Michael Studer, Vice President of the CPC business unit.
For more information about the performance and versatility of CPC's 听portfolio or any of the other 10,000+ innovative connection solutions CPC offers, visit .
础产辞耻迟听颁笔颁:
听is the leading provider of quick disconnect couplings, fittings and connectors for thermal management (liquid cooling of electronics), life sciences, biopharma, industrial and chemical handling markets. During its nearly 50 year-history, CPC has built a portfolio of 10,000-plus connector products. CPC is a business unit of Pump Solutions Group (PSG), an operating company within Dover Corporation.
About Dover:
Dover is a diversified global manufacturer and solutions provider with annual revenue of over
CPC Contact: 听
Jana Stender听
(612) 564-2053
[email protected]听
顿辞惫别谤鈥疢别诲颈补鈥疌辞苍迟补肠迟:
Adrian鈥疭akowicz, VP, Communications
(630) 743-5039
[email protected]
Dover Investor Contact:
Jack Dickens, VP, Investor Relations
(630) 743-2566
[email protected]听
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