Welcome to our dedicated page for Taiwan Semi SEC filings (Ticker: TSM), a comprehensive resource for investors and traders seeking official regulatory documents including 10-K annual reports, 10-Q quarterly earnings, 8-K material events, and insider trading forms.
Finding the EUV spending details or wafer-capacity outlook in TSMC鈥檚 300-page reports can feel overwhelming. From multi-layer risk factors on geopolitical supply chains to intricate revenue splits by process node, TSMC鈥檚 disclosures run deep. That complexity is why investors search for "TSMC SEC filings explained simply" and why this page exists.
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TSMC鈥檚 July 2025 6-K highlights continued top-line momentum. Consolidated revenue reached NT$323.17 bn, up 22.5% versus June and 25.8% year-on-year. Cumulative Jan-Jul revenue climbed to NT$2,096.21 bn, a 37.6% YoY increase, underscoring robust demand for the foundry鈥檚 advanced process nodes.
Liquidity activities remain routine and intra-group focused. Subsidiary lending outstanding totaled NT$15.95 bn (TSMC China NT$14.15 bn; TSMC Development NT$1.80 bn) against board-approved limits of about NT$137 bn. Guarantees to wholly-owned units stood at NT$554.34 bn, well below the aggregate limit of NT$2.50 tn.
Derivative positions were sizeable but manageable: the parent company carried NT$118.40 bn notional forward contracts with an unrealized loss of NT$3.88 bn; other subsidiaries recorded minor unrealized losses. No hedge-accounted contracts show material mark-to-market impact.
No major transactions, earnings guidance, or management changes were disclosed.
On 21 Jul 2025, Taiwan Semiconductor Manufacturing Co. (TSM) filed a Form 6-K/A that only amends Exhibit 99.1鈥攖he Q2 2025 earnings conference presentation. The revision is limited to page 9, where the 2025 revenue outlook wording changes from 鈥�to increase by close to 30%鈥� to 鈥�to increase by around 30%.鈥� No financial figures, guidance ranges, or other disclosures are updated. The filing therefore carries no material impact on previously communicated expectations and serves solely as a textual clarification.
Taiwan Semiconductor Manufacturing Company (NYSE: TSM) filed a Form 6-K for June 2025 detailing corporate actions taken during May 2025.
Capital appropriations dominate the report: the board approved US$15.248 billion of new spending, including US$9.590 billion for advanced-node production equipment, US$308 million for advanced packaging and specialty processes, and US$5.350 billion for real-estate and leased assets. These investments signal continued capacity expansion to meet leading-edge demand.
The filing also discloses NT$16.3 billion in fixed-income asset purchases and NT$0.4 billion in dispositions, illustrating ongoing treasury management.
Insider ownership changes were minor: Senior Vice President Wei-Jen Lo reduced holdings by 5,000 shares, while Vice President Jonathan Lee added 1,234 shares; no pledges were reported.
The board cancelled 117,721 common shares reclaimed from lapsed employee restricted-stock awards, reducing paid-in capital by NT$1,177,210. No unsecured bonds were issued during the period.
Taiwan Semiconductor Manufacturing Company (NYSE:TSM) filed a Form 6-K for June 2025 reporting an internal capital move. A written resolution of wholly-owned subsidiary TSMC Global Ltd., dated 25 June 2025, authorized the issuance of 10,000 new shares with a par value of US$1,000,000 each to the parent company. The transaction adds up to US$10 billion of additional paid-in capital at the subsidiary level, strengthening its balance sheet without introducing external investors or shareholder dilution at the TSM level.
No other material events, financial statements, risk factors, legal proceedings, or management changes are disclosed in the submission. The report was signed by Senior Vice President & CFO Wendell Huang on behalf of the registrant.
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