Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips
- Expansion of joint lab capabilities to include full-flow development and advanced packaging tools
- Strategic focus on energy-efficient solutions for growing AI data center market
- Integration with Applied's global EPIC Platform for faster commercialization of new technologies
- Strengthening of France's semiconductor ecosystem and Grenoble technology hub
- None.
Insights
AMAT's expanded lab with CEA-Leti strengthens its position in specialty chips crucial for energy-efficient AI infrastructure.
This expanded partnership between Applied Materials and CEA-Leti represents a strategic advancement in specialty semiconductor development, specifically targeting the growing demands of AI data centers. The collaboration's focus on ICAPS markets (IoT, Communications, Automotive, Power and Sensors) addresses a critical infrastructure need as AI computing requirements continue to escalate.
The expansion beyond individual process steps to full-flow development signifies a more comprehensive approach to chip innovation. This integration allows for complete device development rather than isolated technological improvements, potentially accelerating time-to-market for new solutions.
Particularly significant is the addition of advanced packaging tools for heterogeneous integration across different wafer types and process nodes. This aligns with the industry's shift toward chiplet architectures and complex packaging solutions that combine diverse semiconductor technologies to optimize performance and energy efficiency.
The partnership also strengthens the European semiconductor ecosystem, specifically in France, as part of broader efforts to develop more geographically distributed chip innovation capabilities. For Applied Materials, this extends their global EPIC Platform innovation model, creating another high-velocity node in their R&D network.
By focusing on energy efficiency in data centers, the collaboration addresses one of the most pressing challenges in AI infrastructure development. The power consumption of AI systems has become a limiting factor in deployment, making innovations in specialty chips that manage power distribution increasingly valuable to the industry.
Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions听To Enable More Energy-Efficient AI Data Centers
SANTA CLARA, Calif. and GRENOBLE, France, June 16, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. and CEA-Leti today announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the organizations plan to expand their and develop materials engineering solutions to address emerging infrastructure challenges in AI data centers.
The joint lab is focused on device innovations for chipmakers serving markets (IoT, Communications, Automotive, Power and Sensors). These specialty chips are used in a wide range of applications 鈥� from industrial automation to electric vehicles 鈥� and they play a critical role managing data and power distribution within data centers. Growing resource demands in AI infrastructure have highlighted the need for a new wave of innovation in ICAPS chips to enable more energy-efficient computing.
Under the new arrangement, Applied and CEA-Leti plan to expand the lab with new equipment and capabilities that move beyond individual process steps to include full-flow development of specialty devices. Additionally, the lab would be equipped with state-of-the-art advanced packaging tools to support heterogeneous integration of chips across different wafer types and process nodes 鈥� enabling entirely new classes of specialty devices for a range of next-generation applications.
The joint facility features several Applied Materials wafer processing systems together with CEA-Leti鈥檚 world-class capabilities for evaluating performance of new materials and device validation. The upgraded lab is expected to strengthen the chipmaking ecosystem in France by further expanding the technology hub in Grenoble, a leading site for collaborative innovation across government, academia and industry. The lab also marks an extension of Applied鈥檚 global EPIC Platform, a new high-velocity innovation model designed to accelerate commercialization of new chip technologies. Applied and CEA-Leti will be able to leverage the R&D work taking place across Applied鈥檚 global innovation centers to drive progress in specialty semiconductor technologies.
鈥淎pplied Materials and CEA-Leti have a long history of successful collaboration, and we are excited to strengthen our capabilities for accelerating innovation and commercialization of next-generation specialty chips,鈥� said Aninda Moitra, corporate vice president and general manager of Applied Materials鈥� ICAPS business. 鈥淥ur combined expertise will help foster breakthroughs and push the boundaries of semiconductor innovation, contributing to sustainable advancements in a range of critical applications for the AI era.鈥�
S茅bastian Dauv茅, CEO of CEA-Leti, said the first phase of the expanded collaboration laid important groundwork for addressing materials-engineering challenges of specialty semiconductor devices.
鈥淏uilding on this momentum, the joint lab鈥檚 new focus on energy-efficient solutions for AI data-center infrastructure reflects our shared commitment to making technological progress that meets both industrial and societal needs. The extended collaboration also leverages our complementary strengths to accelerate innovation at the system level, while supporting sustainable growth in France鈥檚 semiconductor ecosystem,鈥� he said.
About Applied Materials
Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible a better future. Learn more at .
听About CEA-Leti (France)
CEA-Leti, a technology research institute at CEA, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, CEA-Leti pioneers micro-&听nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From听sensors to data听processing and computing solutions, CEA-Leti鈥檚 multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 2,000 talents, a portfolio of 3,200 patents, 11,000 sq. meters of cleanroom space and a clear IP policy, the听institute is based in Grenoble, France, and has offices in Silicon Valley, Brussels and Tokyo.听CEA-Leti has launched 75听startups and is a听member of the Carnot Institutes network. Follow us on and @CEA_Leti.
Technological expertise
CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products.
For more information: 听
Applied Materials Contacts
(U.S. editorial/media) +1 408.235.4676
(Europe editorial/media) +49 174 336 57 68
(financial community) +1 408.986.7977
CEA-Leti Press Contact
Agency
Sarah-Lyle Dampoux
+33 6 74 93 23 47
FAQ
What is the purpose of Applied Materials' expanded collaboration with CEA-Leti?
How will AMAT's joint lab expansion benefit the semiconductor industry?
What markets will be targeted by the AMAT and CEA-Leti joint lab?
What role does the joint lab play in France's semiconductor ecosystem?
How does this collaboration relate to AI infrastructure development?
