SK hynix Begins Mass Production of 321-Layer QLC NAND Flash
SK hynix (HXSCL) has achieved a significant technological breakthrough with the mass production of its 321-layer 2Tb QLC NAND flash, marking the industry's first implementation of 300+ layers using QLC technology. The new product features doubled capacity and enhanced performance metrics, including 56% improved write performance, 18% better read performance, and 23% increased write power efficiency.
The company has increased the number of planes from 4 to 6 for better parallel processing and will initially target PC SSDs before expanding to enterprise SSDs for data centers and UFS for smartphones. Using its proprietary 32DP technology, SK hynix aims to strengthen its position in the ultra-high-capacity eSSD market for AI servers.
SK hynix (HXSCL) ha raggiunto un importante traguardo tecnologico avviando la produzione di massa del suo QLC NAND flash da 2Tb a 321 layer, la prima implementazione nel settore di oltre 300 layer con tecnologia QLC. Il nuovo prodotto offre una capienza raddoppiata e prestazioni superiori, con un write migliorato del 56%, un read migliore del 18% e una efficienza energetica in scrittura aumentata del 23%.
L'azienda ha portato il numero di plane da 4 a 6 per una maggiore parallelizzazione e punter脿 inizialmente agli SSD per PC, per poi estendersi agli SSD enterprise per data center e agli UFS per smartphone. Grazie alla sua tecnologia proprietaria 32DP, SK hynix mira a rafforzare la sua posizione nel mercato degli eSSD ultra ad alta capacit脿 per server AI.
SK hynix (HXSCL) ha conseguido un avance tecnol贸gico importante con la producci贸n en masa de su QLC NAND flash 2Tb de 321 capas, siendo la primera implementaci贸n del sector con m谩s de 300 capas en tecnolog铆a QLC. El nuevo producto ofrece capacidad duplicada y mejores prestaciones, incluyendo un rendimiento de escritura un 56% superior, un lectura un 18% mejor y una eficiencia de potencia en escritura aumentada un 23%.
La compa帽铆a ha incrementado el n煤mero de planes de 4 a 6 para mejorar el procesamiento paralelo y se enfocar谩 inicialmente en SSD para PC antes de expandirse a SSD empresariales para centros de datos y UFS para smartphones. Con su tecnolog铆a propietaria 32DP, SK hynix busca consolidarse en el mercado de eSSD de ultra alta capacidad para servidores de IA.
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SK hynix (HXSCL) a r茅alis茅 une avanc茅e technologique majeure en lan莽ant la production de masse de son QLC NAND flash 2Tb 脿 321 couches, premi猫re mise en 艙uvre du secteur au-del脿 de 300 couches avec la technologie QLC. Le nouveau produit offre une capacit茅 doubl茅e et des performances am茅lior茅es, notamment une vitesse d'茅criture am茅lior茅e de 56%, une vitesse de lecture meilleure de 18% et une efficacit茅 茅nerg茅tique en 茅criture augment茅e de 23%.
L'entreprise a port茅 le nombre de planes de 4 脿 6 pour une meilleure parall茅lisation et ciblera d'abord les SSD pour PC avant d'茅tendre l'offre aux SSD entreprise pour centres de donn茅es et aux UFS pour smartphones. Gr芒ce 脿 sa technologie propri茅taire 32DP, SK hynix vise 脿 renforcer sa position sur le march茅 des eSSD ultra-haute capacit茅 pour serveurs AI.
SK hynix (HXSCL) hat einen bedeutenden technologischen Durchbruch erzielt und die Massenproduktion seines 321-lagigen 2Tb QLC NAND-Flash gestartet 鈥� die erste Branchenimplementierung von 眉ber 300 Lagen mit QLC-Technologie. Das neue Produkt bietet verdoppelte Kapazit盲t und verbesserte Leistungswerte, darunter 56% bessere Schreibperformance, 18% schnelleres Lesen und 23% h枚here Schreibleistungs-Effizienz.
Das Unternehmen hat die Zahl der Planes von 4 auf 6 erh枚ht, um die Parallelverarbeitung zu verbessern, und zielt zun盲chst auf PC-SSDs ab, bevor es auf Enterprise-SSDs f眉r Rechenzentren und UFS f眉r Smartphones erweitert. Mit seiner propriet盲ren 32DP-Technologie will SK hynix seine Position im Markt f眉r ultra-hochkapazitive eSSDs f眉r KI-Server st盲rken.
- None.
- Commercial launch delayed until first half of 2026 pending customer validation
- Development of the industry's highest-density QLC product completed, commercial launch scheduled for the first half of next year following completion of customer validation
- Expansion of independent operation units ("planes") enables simultaneous large capacity and high performance, optimized for ultra-high-capacity eSSDs for AI servers
- Company to broaden cost-competitive, high-capacity product lineup in response to rapidly growing AI demand and high-performance requirements
To maximize the cost competitiveness of its new product, SK hynix developed a 2Tb device with double the capacity of existing solutions. To address potential performance degradation in large-capacity NAND, the company increased the number of planes[2], independent operation units within a chip, from 4 to 6. This enables greater parallel processing and significantly enhances simultaneous read performance.
As a result, the 321-layer QLC NAND delivers both higher capacity and improved performance compared to previous QLC products. Data transfer speed has doubled, write performance has improved by up to
The company plans to apply its 321-layer NAND first to PC SSDs, before expanding to enterprise SSDs (eSSD) for data centers and UFS for smartphones. Leveraging its proprietary 32DP[3] technology, which enables the simultaneous stacking of 32 NAND dies in a single package, SK hynix aims to enter the ultra-high-capacity eSSD market for AI servers by achieving twice the integration density.
"With the start of mass production, we have significantly strengthened our high-capacity product portfolio and secured cost competitiveness," said Jeong Woopyo, Head of NAND Development. "We will make a major leap forward as a full-stack AI memory provider, in line with the explosive growth in AI demand and high-performance requirements in the data center market."
About SK hynix Inc.
SK hynix Inc., headquartered in
[1] NAND flash is categorized as single-level cell (SLC), multi-level cell (MLC), triple-level cell (TLC), QLC, and penta-level cell (PLC) depending on how many data bits can be stored in one cell. As the amount of information storage increases, more data can be stored in the same volume. |
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SOURCE SK hynix Inc.
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